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• PCB P/N:104_DCP_R2
• Layer Count:4L
• Material:FR-4 TG130
• Board thk:1.6mm
• copper thk:1/1/1/1oz
• Smallest hole size:0.3MM
• No. of holes (pcs):295
• line w/s:12/8mil
• Impedance control. Y / N (Tol %):N
• Surface Finishing:ENIG    Au:0.05-0.10UM
• Solder Mask Silkscreen:Green
• Single board size:Dim X (mm):80;Dim Y (mm):116
• Panelisation:Dim X (mm):80;Dim Y (mm):116;No Of UPS:1
• Special:peelable mask:N
• Routing/Punching:CNC