Micromac  3d  microDICE system 激光切割

Cost, quality, and throughput are major factors of success for SiC based devices in the semiconductor industry. 3D-Micromac answers this challenge with its brand-new microDICE™ system.

The revolutionary, high-performance microDICE™ laser dicing system brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end.

The microDICE™ separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput.

In addition, microDICE™ considerably reduces the dicing cost per wafer. Due to the contactless laser machining there is no tool wear and no expensive consumables required. This results in excellent cost of ownership during the whole life-time of the dicing system.

Compared to traditional separation technologies microDICE™ provides a much higher process speed and better throughput leading to high-volume production of SiC based devices. microDICE™ is suitable to dice wafers up to 300 mm wafer size.

The modular standard system configuration consists of:

·        Cleaving funtion

·        Soft scribe function

·        Micro stretching function