| 外形尺寸：36.6mm*40.3mm*3.43mm |
| 参数配置 ：SM+XD （二合一卡座） |
1.MATERIAL
Insulator:High Temperature Thermoplastic,
UL94V-O
Contact:Copper Alloy
Shell:Copper Alloy
2.PLATING
Contact Area:Gold PLATED Over Ni.
Solder Tail:Sn PLATED Over Ni.
Shell Solder Arda:Gold PLATED Over Ni.
3.ELECTRICAL
Operating Temperature:-25℃ TO+90℃
Current Rating:0.5mA max.
Contact Resistance:100mΩ max.
Insulation Resistance:1000MΩ min./500VDC |
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